下面为大家介绍努力为所有人提供有价值体验的三星电机的历史。
Component
Camera Module
Substrate
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三星电机可以应对 OSP、ENIG、ENEPIG、ENIG+EG、EPIG等所有种类的表面处理。
主要是通过电解 Ni/Au、ENIG、ENPIG进行镀金工艺,电解 Ni/Au可分为 Thick Ni/Au和 Thin Ni/Au。
Mobile AP用 FCCSP作为市场的领头羊,为移动设备市场的主要客户提供多种技术Solution。Memory MDRAM、Flash、eMCP/eMMC用 FBGA以 2,000年代初 0.22T 厚度的 CSP基板为开端,提供 0.13T 以下的 UT-CSP 及 3层以上的 Build-up 产品。
各认证机构的有效期明示略有不同。认证机构 BSI不管任证书上的截止日期,只将焦点放在认证有效性是否通过事后更新和审核。也就是说,认证书上标注了到期日期,并非表示所有认证都在那时到期,而是需要不断审核才能维持那项认证。与此相反,像TS/TL规格本身要求包含证书到期日期时,认证书上就标记了相应到期日期。需要有效确认认证书时,将为您发送 BSI发行的公文。
RoHS是关于 6种有害物质(Pb, Cd, Cr6+, Hg, PBB, PBDE)的使用规制的指南,Pb Free是只针对 Pb的规制内容。换句话说,可以说Pb Free包含在RoHS中。Pb Free 规制从几年前开始实行,RoHS是在EU自 2006年 7月 1日起开始实行的规制。,满足RoHS,自然也满足于Pb Free。
BGA是 Ball Grid Array缩写,主要用于包装用基板。这是为了实现半导体和Mainboard的电连接,与现有 Lead Frame(外围连接线)不同,采用利用 Solder Ball的实装方式,可连接多数 I/O。
为保护半导体免受外部冲击、潮湿等环境,同时可实现电信号的输入输出,起到连接半导体和外部终端的作用。
Embedded PCB采用将 PCB 上实装的零件安装到PCB内部的方式,各种能动/被动元件间的距离缩短,信号干涉减少,有利于高速化产品。
这两种都是为形成fine pattern的 additive 工艺,但 Seed Cu 形成方法和 Seed Cu 去除方法存在差异。- SAP : 将化学铜(1μm 内外)作为 Seed,图形电镀后将 Seed用 Flash Etching去除- mSAP : 将铜箔(1.5~2μm)+化学铜作为 Seed,将 Seed用 Quick Etching去除
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