SAMSUNG ELECTRO-MECHANICS

Samsung Electro-Mechanics announced on the 4th that it will showcase next-generation semiconductor substrate technology at “KPCA Show 2024.”

KPCA Show (International PCB & Semiconductor Packaging Exhibition) is the largest domestic exhibition for substrates, materials, and equipment, featuring both domestic and international companies. The event will be held from September 4 to 6 at Songdo Convensia, Incheon. 

As Korea's largest semiconductor package substrate company, Samsung Electro-Mechanics displayed large-area, high-layer, and ultra-slim next-generation semiconductor substrates at this exhibition to showcase its technological prowess.

Semiconductor package substrates are products that connect high-density semiconductor chips to mainboards to transmit electrical signals and power. As the industry paradigm shifts towards servers, AI, cloud, and automotives, semiconductor substrates are becoming crucial in differentiating semiconductor performance. The advancement in semiconductor performance demands high-level technologies such as increased internal layers, fine circuit implementation, precise interlayer alignment, and thickness reduction.

At the exhibition, Samsung Electro-Mechanics has organized its booths around two themes: ▲ Advanced Package Substrate Zone and ▲ On-Device AI Package Substrate Zone. In the center of the booth, product dissections featuring semiconductor substrates were displayed to enhance understanding of actual application areas.

In the Advanced Package Substrate Zone, Samsung Electro-Mechanics showcased core technologies of high-end AI/server FCBGA currently in mass production. The AI/server FCBGA introduced this time is a high-complexity product that implements more than 20 layers, which is six times the size (area) and twice the number of internal layers of a regular FCBGA, designed to handle high-speed signal processing. Samsung Electro-Mechanics possesses industry-leading technology as the only domestic company producing server FCBGA.

Additionally, Samsung Electro-Mechanics introduced next-generation package substrate technologies evolving in line with the semiconductor high-performance trend.

This includes 2.1D package substrate technology that connects semiconductors directly without using a silicon interposer, and Co-Package substrates that integrate SoCs and memory on a single substrate.

In particular, Samsung Electro-Mechanics unveiled a glass substrate for the first time, which innovatively improved bending characteristics and signal loss in large-area substrates by applying glass material to the core. Through an introduction of core technologies and key specifications of glass substrates, Samsung Electro-Mechanics demonstrated its focus on securing technological competitiveness in the next-generation substrate market. 

In the On-Device AI Package Substrate Zone, Samsung Electro-Mechanics displayed products currently in mass production that cater to the AI era. Samsung Electro-Mechanics introduced the world’s No. 1 FCCSP (Flip Chip Chip Scale Package) substrates for AI smartphone APs and UTCSP (Ultra Thin Chip Scale Package) substrates for memory, thin UTC (Ultra Thin Core) substrates for AI notebooks, and embedded substrates that enhance semiconductor performance through passive embedded technology.

Kim Eungsoo, Head of Package Solution Unit at Samsung Electro-Mechanic, stated, “Samsung Electro-Mechanics is expanding cooperation with global key customers based on world-class package substrate technology," and added, "We will focus on the high-end substrate market, including servers, AI, and autonomous driving, by securing the essential technologies required in the next-generation semiconductor substrate market."

Since starting the substrate business in 1991, Samsung Electro-Mechanics has led the industry with differentiated technology, supplying products to top global companies. In particular, it holds the leading position in mobile AP semiconductor substrates in terms of market share and technology. 

Recently, Samsung Electro-Mechanics has been concentrating its efforts on securing next-generation core technologies such as ultra-large area, ultra-high layer, ultra-fine circuits, and glass material utilization as future-leading technologies.