MLCC

MLCC(Multilayer Ceramic Capacitors)起到储电后定量输送电的“水坝”作用，调节使电流在电路中定量传输，防止元器件间出现电磁波干扰现象。厚度为0.3mm，仅为一粒米的250分之1，在如此薄的厚度中其内部只有尽量实现薄的多层堆叠，才能储存更多的电，因此这是技术能力十分重要的部分。

引领变化的三星电机

在即将到来的5G时代，随着电子设备、无人驾驶车辆的发展，以及IoT的扩大，MLCC将会变得愈加重要。三星电机能够生产600叠层的高容量MLCC，具备极高的技术能力。三星电机迎合市场趋势，竭力开发微型、超高容量产品，开发高信赖度、高品质的高新技术集约体。

  • 微型·超高容量
  • 品质信赖度
  • 全球市场领先

Normal

一般的 MLCC是在电路上暂时充电，去除噪音的最普通芯片形态的 Capacitor 。是能够实现多尺寸和大范围容量的产品群，拥有在 PCB上快速贴装芯片的结构。

应用
智能手机、PC、HDD/SSD板、平板、Display、游戏机、DC-DC Converter、车载应用程序

Lineup

1.Ceramic body, 2.Electrode(Ni), 3.Termination(Cu), 4.Plating(Ni), 5.Plating(Sn) *内部铜电极将仅适用于某些产品。

  • Wide Selection of Size & Wide Capacitance Range

    能够实现多尺寸及大范围容量的产品

  • Excellent DC Bias Characteristics

    DC Bias 特性优秀的 Capacitor

  • High Speed Automatic Chip Placement on PCBs

    能够实现在PCB上快速贴装芯片

LSC

为应对轻薄设备及模块，贴装于Solder Ball中间，减小模块厚度，或在基板内部形成 Embedded，可确保贴装面积。 能够为移动设备的高速 AP快速提供稳定电流，去除高频噪音，减少外部环境压力影响。

应用
智能手机、可穿戴设备、IC 封装、模块产品

Lineup

Thin in terms of Thickness, Embedded type (Cu Plating), LSC type (Ni –Sn Plating)

  • Thin in terms of Thickness

    能够应对轻薄设备及模块的厚度

  • Removing High Frequency Noise

    去除高频噪音

High Bending Strength

High Bending Strength(General)

能够通过Soft Termination的柔性(Ductile Properties)，减少对芯片施加的热性/机械性压力，拥有强力应对 Board Bending压力的特性。

应用
所有应用程序 (智能手机、PC、HDD/SSD板、平板、显示器等) ，尤其主要用于 Power(SMPS, DC-DC Converter)、产业用应用程序

Lineup

1.Ni/Sn, 2.Metal/Epoxy termination, 3.Cu-term

  • Relax The Applied External Stress

    能够减少对芯片施加的热性/机械性压力的产品

  • Excellent Bending Strength

    优秀的弯曲强度

High Bending Strength(Automotive)

PCB的机械性/热性发生变形时，为不使 MLCC 出现不良，应用应对外部变形的压力管理技术的产品，比现有产品的耐久性更强，可应用于要求安全性的应用程序。

应用
车载用应用程序

Lineup

Cu term. Epoxy

  • Bending Crack Prevention

    为不使因PCB变形导致弯曲裂开，应用能够吸收压力的电导性Epoxy材料技术

  • 5mm Bending Guarantee

    保证不因Board Flex 5mm 变形而导致 Bending Crack

ESD Protection

为从ESD保护电路进行使用，而进行专业化的产品，与普通 MLCC 产品相比，保证更高水平的 ESD。满足IEC 61000-4-2 规格。

应用
车载用应用程序

Lineup

GND

  • IEC 61000-4-2 Standard

    进行满足IEC 61000-4-2 规格的 ESD 试验

  • DC Bias Stability

    拥有与普通 MLCC 相比更好的 DC Bias 特性

Fail Safe (Soft Termination 5mm)

即使MLCC产品发生裂开，内部发生短路，但还能够防止电路操作不当，由此而设计的产品。而且还增添保证了 5mm 弯带，防止因 PCB 变型导致不良。是 MLCC 产品中安全性最高的产品。

应用
车载用应用程序

Lineup

  • THMC -> [ Cross-Sectioned View ], Bottom Cover
  • Conductor Material - Ag
  • External Electrode - Ag Termination - Ni + Sn Plating
  • Series Design

    像串联连接的两个 MLCC一样工作的设计
    即使一边出现裂开等不良现象，另一边也能够保护电路

  • 5mm Bending Guarantee

    保证不因电路板弯曲5mm而导致破损

Low Acoustic Noise

电子设备中因压电现象导致 MLCC 出现震颤，MLCC的这种震颤传递到基板，基板开始震颤，就会出现 Audible Noise(20Hz~20kHz)。Low Acoustic Noise 产品能够有效减少这种噪音。

应用
PAM (GSM / TD-SCDMA / TDD-LTE), PMIC, DC-DC Converter

Lineup

Thin in terms of Thickness, Embedded type (Cu Plating), LSC type (Ni –Sn Plating)

  • Reducing Audible Noise

    减少因压电特性导致的机械性震动噪音

  • Pin to Pin Solution

    立即替代现有产品，能够建立减少噪音对策的解决方法

Low ESL

具备低等价串联感应系数(ESL : Equivalent Series Inductance)的 MLCC，能够用少数代替高速 IC用 MLCC，用于有贴装面积限制的电路。

应用
所有应用程序 (智能手机、可穿戴设备、IC封装、PC)

Lineup

  • [用于 Multiple MLCC Used]-Multiple MLCC Used for Energy Transfer (MLCC / MLCC / MLCC / High Speed IC(AP))
  • [用于 Low ESL MLCC Used]-Low ESL MLCC (Saved Space / High Speed IC(AP))
  • Faster Energy Transfer

    通过稳定性能快速传送能量

  • Saving Space by One Chip

    可少数代替，节约空间

Array

随着各种移动设备等电子设备小型化，为确保贴装空间，将各种芯片统一成一体的产品。有节约贴装费用和减少 Ripple Voltage 的效果。

应用
所有应用程序 (智能手机、PC、HDD/SSD 板、平板、显示器等)

Lineup

Thin in terms of Thickness, Embedded type (Cu Plating), LSC type (Ni –Sn Plating)

  • High Performance & Space Saving

    高性能产品可以有效减少安装面积

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