2020 - Now
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2025
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- 03
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The 52nd ordinary general meeting of shareholders
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- 02
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Develops World’s First MLCC for LiDAR Applications
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2024
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- 11
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Receives Global Certification for Automotive Camera Software Achieves A-SPICE Level 3
Showcase its technology at ‘Electronica 2024’
Holds Blue Elephant Forum on Preventing Cyber Violence
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- 10
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Holds “Win-Win Cooperation Communication Forum”
Develops High-Resolution Camera Module Capable of Microscopic-Level Close-Ups
“Upcycled” Work Uniforms from MLCC Waste First Launch in Korea
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- 09
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Develops All-Solid-State Battery for Wearables
Holds 2024 SAT in Tianjin
Demonstrates Semiconductor Package Substrate Technology at “KPCA Show 2024”
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- 07
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Collaborates with AMD to Supply High-Performance Substrates for Hyperscale Data Center Computing
Develops 2,000V High-Voltage MLCCs for Electric Vehicles
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- 05
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Semiconductor Package Tech & Career Forum
Presents the Future of Electronic Components in Busan through ‘SCC’
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- 03
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Held the “2024 Win-Win Cooperation Day”
Develops High-Voltage MLCCs for Automotive
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- 01
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Develops world’s highest capacity MLCCs at 16V rating for autonomous driving cars
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2023
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- 09
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Mass produces industry's first thin-film coupled power inductor
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- 07
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Mass production of Power Inductors for ADAS Camera
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- 05
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Development of the world's highest capacity MLCC for electric vehicles(250V 33㎋, 100V 10㎌)
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- 03
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Mass production of 200-megapixel OIS camera modules
The 50th ordinary general meeting of shareholders
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2022
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- 11
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Mass produced Korea’s first high-performance semiconductor package substrate for servers (FCBGA)
Signed MOU with POSTECH to develop talent in materials and components
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- 04
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Developed 13 types of MLCC for automotive powertrains
Hosted Win-Win Day with suppliers
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- 01
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Selected Samsung Master Artisan and Maestro
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2021
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- 11
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Developed MLCC for 5G base stations
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- 08
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Developed MLCCs for ADAS
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- 03
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Started mass production of optical 10x zoom folded camera module
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2020
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- 09
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Develops world’s smallest Power Inductor
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- 07
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Developed 5 types of MLCCs for automotive powertrains and ABS
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- 01
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Selected Samsung Master Artisan and Maestro
2010 - 2019
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2019
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- 05
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Started the production of ultra-slim 5x optical zoom camera modules
Opened the Detroit office in the U.S
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- 04
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Developed the world’s smallest 5G antenna module
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2018
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- 12
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Achieved KRW 1 trillion in operating profits
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2017
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- 05
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Constructed the new plant in Tianjin (former Binhai Branch)
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- 04
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Constructed a new plant in the Philippines
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- 03
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Launched a new Tianjin branch (Constructed with the New Binhai plant)
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2016
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- 05
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Samsung Electro-Mechanics was selected as a good parts supplier of Lenovo
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- 03
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Samsung Electro-Mechanics hosted the 2016 Mutual Growth Festival
Samsung Electro-Mechanics was selected as a good parts supplier of Intel
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2014
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- 01
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The world's first self-resonating wireless charger was certified
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2013
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- 10
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Samsung Electro-Mechanics developed the world's best performing camera module
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- 09
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Samsung Electro-Mechanics built its new production site in Vietnam
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2011
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- 10
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Samsung Electro-Mechanics developed the world's best performing 0603-standard 2.2-uF MLCC
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- 09
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A ceremony to commemorate the construction of Binhai Factory in Tianjin, China was held.
Samsung Electro-Mechanicsdeveloped the household smart camera module.
2000 - 2009
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2009
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- 10
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Samsung Electro-Mechanics developed the world's first 12-m 3x-zoom ISM
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- 06
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Samsung Electro-Mechanics developed the world's first third-generation antenna
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- 04
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Samsung Electro-Mechanics developed the world's first 0603, 1-uF MLCC
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2007
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- 11
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Samsung Electro-Mechanics developed the world's first 8-Mp CMOS camera module for mobile phones
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- 09
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Samsung Electro-Mechanics developed its 0.08 mm-thick semiconductor board
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2006
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- 11
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Samsung Electro-Mechanics developed the world's first 1608-spec 22-uF MLCC
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- 09
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Flip chip CSP board entered mass production
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- 06
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Samsung Electro-Mechanics published the first sustainability report in the parts industry
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- 04
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Samsung Electro-Mechanics developed the world's smallest 2-Mp camera module
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2005
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- 11
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Samsung Electro-Mechanics developed the world's thinnest 0.1-mm semiconductor board
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- 03
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The first Samsung Electro-Mechanics Best Paper Award was held.
Samsung Electro-Mechanics developed the world's first 5-Mp CMOS camera module
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2003
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- 09
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Samsung Electro-Mechanics developed the world's smallest 0402 MLCC
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2002
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- 07
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Samsung Electro-Mechanics became the first in the world to commercialize the production method for the next-generation printed circuit board (Stack Via)
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2001
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- 10
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Samsung Electro-Mechanics developed and mass produced the world's smallest 0603 MLCC
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- 05
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A production plant was built for Samsung High-Tech Electro-Mechanics (Tianjin)
1990 - 1999
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1997
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- 07
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A production branch in Philippines was established
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1996
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- 10
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Suwon Plant became the world's first electronic parts company to receive ISO 14001 certification
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- 04
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The Men's and Women's Badminton Club was founded
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1994
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- 01
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A production plant was built in Tianjin, China
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1992
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- 07
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A production plant was built in Dongguan, China
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1991년
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- 11
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The MLB (Multilayered Printed Circuit Board) Factory was built in Sejong City
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1990
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- 11
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A production plant was built in Thailand
1980 - 1989
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1988
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- 02
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Samsung Electro-Mechanics developed Korea's first micro multilayer ceramic capacitor (MLCC) (1608 Size)
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1987
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- 02
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The company’s name was changed to Samsung Electro-Mechanics
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1985
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- 12
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The company was designated as a precision technology factory with a grade of 1 (Ministry of Commerce and Industry, No. 28)
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1980
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- 10
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The company’s General Research Center was built
1970 - 1979
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1979
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- 02
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The company was listed on the Korea Stock Exchange
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1978
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- 04
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It independently developed the color TV tuner (VHF Tuner, UHF Tuner, Doubler)
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1977
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- 05
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The company changed its name from Samsung Electro-Mechanic Parts to Samsung Electronic Parts
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1974
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- 03
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The company’s name was changed from Samsung-Sanyo Parts Co., Ltd. to Samsung Electro-Mechanic Parts
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1973
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- 11
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The company was founded
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- 08
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Samsung-Sanyo Parts Co,. Ltd. was registered for incorporation