History & Awards

A global leader in electronic components that is changing the world

2020 - Now

  • 2024

  • 07

    Collaborates with AMD to Supply High-Performance Substrates for Hyperscale Data Center Computing

    Develops 2,000V High-Voltage MLCCs for Electric Vehicles

  • 05

    Semiconductor Package Tech & Career Forum

    Presents the Future of Electronic Components in Busan through ‘SCC’

  • 03

    Held the “2024 Win-Win Cooperation Day”

    Develops High-Voltage MLCCs for Automotive

  • 01

    Develops world’s highest capacity MLCCs at 16V rating for autonomous driving cars

  • 2023

  • 09

    Mass produces industry's first thin-film coupled power inductor

  • 07

    Mass production of Power Inductors for ADAS Camera

  • 05

    Development of the world's highest capacity MLCC for electric vehicles(250V 33㎋, 100V 10㎌)

  • 03

    Mass production of 200-megapixel OIS camera modules

    The 50th ordinary general meeting of shareholders

  • 2022

  • 11

    Mass produced Korea’s first high-performance semiconductor package substrate for servers (FCBGA)

    Signed MOU with POSTECH to develop talent in materials and components

  • 04

    Developed 13 types of MLCC for automotive powertrains

    Hosted Win-Win Day with suppliers

  • 01

    Selected Samsung Master Artisan and Maestro

  • 2021

  • 11

    Developed MLCC for 5G base stations

  • 08

    Developed MLCCs for ADAS

  • 03

    Started mass production of optical 10x zoom folded camera module

  • 2020

  • 09

    Develops world’s smallest Power Inductor

  • 07

    Developed 5 types of MLCCs for automotive powertrains and ABS

  • 01

    Selected Samsung Master Artisan and Maestro

2010 - 2019

  • 2019

  • 05

    Started the production of ultra-slim 5x optical zoom camera modules

    Opened the Detroit office in the U.S

  • 04

    Developed the world’s smallest 5G antenna module

  • 2018

  • 12

    Achieved KRW 1 trillion in operating profits

  • 2017

  • 05

    Constructed the new plant in Tianjin (former Binhai Branch)

  • 04

    Constructed a new plant in the Philippines

  • 03

    Launched a new Tianjin branch (Constructed with the New Binhai plant)

  • 2016

  • 05

    Samsung Electro-Mechanics was selected as a good parts supplier of Lenovo

  • 03

    Samsung Electro-Mechanics hosted the 2016 Mutual Growth Festival

    Samsung Electro-Mechanics was selected as a good parts supplier of Intel

  • 2014

  • 01

    The world's first self-resonating wireless charger was certified

  • 2013

  • 10

    Samsung Electro-Mechanics developed the world's best performing camera module

  • 09

    Samsung Electro-Mechanics built its new production site in Vietnam

  • 2011

  • 10

    Samsung Electro-Mechanics developed the world's best performing 0603-standard 2.2-uF MLCC

  • 09

    A ceremony to commemorate the construction of Binhai Factory in Tianjin, China was held.

    Samsung Electro-Mechanicsdeveloped the household smart camera module.

2000 - 2009

  • 2009

  • 10

    Samsung Electro-Mechanics developed the world's first 12-m 3x-zoom ISM

  • 06

    Samsung Electro-Mechanics developed the world's first third-generation antenna

  • 04

    Samsung Electro-Mechanics developed the world's first 0603, 1-uF MLCC

  • 2007

  • 11

    Samsung Electro-Mechanics developed the world's first 8-Mp CMOS camera module for mobile phones

  • 09

    Samsung Electro-Mechanics developed its 0.08 mm-thick semiconductor board

  • 2006

  • 11

    Samsung Electro-Mechanics developed the world's first 1608-spec 22-uF MLCC

  • 09

    Flip chip CSP board entered mass production

  • 06

    Samsung Electro-Mechanics published the first sustainability report in the parts industry

  • 04

    Samsung Electro-Mechanics developed the world's smallest 2-Mp camera module

  • 2005

  • 11

    Samsung Electro-Mechanics developed the world's thinnest 0.1-mm semiconductor board

  • 03

    The first Samsung Electro-Mechanics Best Paper Award was held.

    Samsung Electro-Mechanics developed the world's first 5-Mp CMOS camera module

  • 2003

  • 09

    Samsung Electro-Mechanics developed the world's smallest 0402 MLCC

  • 2002

  • 07

    Samsung Electro-Mechanics became the first in the world to commercialize the production method for the next-generation printed circuit board (Stack Via)

  • 2001

  • 10

    Samsung Electro-Mechanics developed and mass produced the world's smallest 0603 MLCC

  • 05

    A production plant was built for Samsung High-Tech Electro-Mechanics (Tianjin)

1990 - 1999

  • 1997

  • 07

    A production branch in Philippines was established

  • 1996

  • 10

    Suwon Plant became the world's first electronic parts company to receive ISO 14001 certification

  • 04

    The Men's and Women's Badminton Club was founded

  • 1994

  • 01

    A production plant was built in Tianjin, China

  • 1992

  • 07

    A production plant was built in Dongguan, China

  • 1991년

  • 11

    The MLB (Multilayered Printed Circuit Board) Factory was built in Sejong City

  • 1990

  • 11

    A production plant was built in Thailand

1980 - 1989

  • 1988

  • 02

    Samsung Electro-Mechanics developed Korea's first micro multilayer ceramic capacitor (MLCC) (1608 Size)

  • 1987

  • 02

    The company’s name was changed to Samsung Electro-Mechanics

  • 1985

  • 12

    The company was designated as a precision technology factory with a grade of 1 (Ministry of Commerce and Industry, No. 28)

  • 1980

  • 10

    The company’s General Research Center was built

1970 - 1979

  • 1979

  • 02

    The company was listed on the Korea Stock Exchange

  • 1978

  • 04

    It independently developed the color TV tuner (VHF Tuner, UHF Tuner, Doubler)

  • 1977

  • 05

    The company changed its name from Samsung Electro-Mechanic Parts to Samsung Electronic Parts

  • 1974

  • 03

    The company’s name was changed from Samsung-Sanyo Parts Co., Ltd. to Samsung Electro-Mechanic Parts

  • 1973

  • 11

    The company was founded

  • 08

    Samsung-Sanyo Parts Co,. Ltd. was registered for incorporation

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