2020 - Now
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2026
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- 04
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2026 Win-Win Cooperation Day held
'2026 SCC' held in Busan
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- 03
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53rd Annual General Shareholders' Meeting held
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2025
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- 12
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Invested in 'Alba Industries', a company specializing in small electric motors
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- 11
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Signed MOU with Sumitomo Chemical Group for 'Glass Core' for package substrates
'2025 Safety and Environment Workshop' held for partner companies
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- 09
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'2025 SAT' held in Tianjin, China
'2025 Win-Win Growth Communication Forum' held with partner companies
Established 'Advanced Materials Industry-Academia Cooperation Center' with Seoul National University
6th Blue Elephant 'School & Cyberbullying Prevention Contest' awards ceremony held
Participated in KPCA Show 2025
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- 06
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Started mass production of semiconductor substrates for AI accelerators
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- 04
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2025 Win-Win Cooperation Day held
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- 03
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52nd Annual General Shareholders' Meeting held
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- 02
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Developed world's first MLCC for LiDAR
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2024
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- 11
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Obtained global certification for automotive camera software, A-SPICE Level 3
Participated in electronica 2024
Held Blue Elephant Forum for cyberbullying prevention
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- 10
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Held Win-Win Growth Communication Forum
First development of all-solid-state battery for wearables
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- 09
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First domestic introduction of work uniforms upcycled from MLCC waste
'2024 SAT' held in Tianjin, China
Participated in 2024 KPCA Show
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- 07
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Cooperated with AMD to supply high-performance substrates for hyperscale data centers
Developed 2,000V MLCC for electric vehicles
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- 05
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Held Semiconductor Package Tech & Career Forum
'SCC' held
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- 03
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'2024 Win-Win Cooperation Day' held
51st Annual General Shareholders' Meeting held
Developed high-voltage MLCC for automotive electronics
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- 01
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Developed world's highest-capacitance 16V MLCC for autonomous vehicles
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2023
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- 09
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First in the industry to mass-produce thin-film coupled power inductors
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- 07
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Mass production of power inductors for ADAS cameras
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- 05
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Developed world's highest-capacitance MLCC for electric vehicles (250V 33μF, 100V 10μF)
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- 03
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Mass production of 200MP OIS camera modules
50th Annual General Shareholders' Meeting
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2022
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- 11
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First in Korea to mass-produce high-performance semiconductor package substrates (FCBGA) for servers
Signed MOU with POSTECH for nurturing talent in materials and components
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- 04
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Developed 13 types of MLCC for automotive powertrains
Held Win-Win Cooperation Day inviting partner companies
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- 01
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Selected Samsung Master and Maestro
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2021
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- 11
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Developed MLCC for 5G base stations
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- 08
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Developed MLCC for ADAS
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- 03
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Mass production of 10x optical zoom folded camera modules
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2020
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- 09
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Developed world's smallest power inductor
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- 07
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Developed 5 types of MLCC for automotive powertrain and ABS
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- 01
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Selected Samsung Master and Maestro
2010 - 2019
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2019
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- 05
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Opened Detroit office in the US
Mass production of ultra-slim 5x optical zoom camera modules
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- 04
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Developed world's smallest 5G antenna module
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2018
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- 12
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Joined the 1 Trillion KRW Operating Profit Club
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2017
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- 05
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Completed new Tianjin plant (formerly Binhai plant)
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- 04
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Completed new Philippine plant
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- 03
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Launched new Tianjin corporation (integrated with new Binhai plant)
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2016
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- 03
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Held 2016 Win-Win Growth Festival
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2014
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- 01
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World's first wireless charging certification using magnetic resonance
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2013
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- 10
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Developed world's highest-performance camera module
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- 09
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Established manufacturing subsidiary in Vietnam
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2011
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- 10
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Developed world's highest-performance 0603 size 2.2uF MLCC
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- 09
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Completion ceremony for Binhai plant in Tianjin, China
Developed camera module for smart home appliances
2000 - 2009
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2009
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- 10
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World's first 12M 3x zoom ISM developed
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- 06
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World's first development of 3rd generation antenna
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- 04
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World's first 0603, 1uF MLCC developed
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2007
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- 11
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World's first 8MP CMOS camera module for mobile phones developed
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- 09
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Developed 0.08mm substrate for semiconductors
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2006
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- 11
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World's first 22uF MLCC in 1608 size developed
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- 09
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Mass production of flip-chip CSP substrates
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- 06
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First in the components industry to publish a sustainability report
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- 04
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Developed world's thinnest 2MP camera module
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2005
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- 11
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Developed world's thinnest 0.1mm substrate for semiconductors
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- 03
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1st Samsung Electro-Mechanics Paper Award held
World's first 5MP CMOS camera module developed
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2003
-
- 09
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World's first ultra-small 0402 MLCC developed
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2002
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- 07
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World's first commercialization of next-generation PCB (Stackvia) process
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2001
-
- 10
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Developed and mass-produced world's smallest 0603 MLCC
-
- 05
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Established manufacturing subsidiary in Gaoxin, China
1990 - 1999
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1997
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- 07
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Established manufacturing subsidiary in the Philippines
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1996
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- 10
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Suwon plant became the first in the global electronic components industry to obtain ISO 14001 certification
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- 04
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Founded men's and women's badminton teams
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1994
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- 01
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Established manufacturing subsidiary in Tianjin, China
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1992
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- 07
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Established manufacturing subsidiary in Dongguan, China
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1991
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- 11
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Completed MLB (multi-layer PCB) plant at Sejong site
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1990
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- 11
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Established manufacturing subsidiary in Thailand
1980 - 1989
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1988
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- 02
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Developed Korea's first ultra-small multilayer ceramic capacitor (MLCC) (1608 size)
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1987
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- 02
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Changed company name to Samsung Electro-Mechanics Co., Ltd.
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1985
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- 12
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Designated as Grade 1 Precision Technology Factory (No. 28 by Ministry of Commerce and Industry)
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1980
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- 10
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Completed comprehensive research institute
1970 - 1979
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1979
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- 02
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Listed on Korea Stock Exchange
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1978
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- 04
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Independently developed tuners for color TVs (VHF tuner, UHF tuner, Doubler)
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1977
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- 05
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Changed company name from Samsung Electric Parts Co., Ltd. to Samsung Electronics Parts Co., Ltd.
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1974
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- 03
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Changed company name from Samsung Sanyo Parts Co., Ltd. to Samsung Electro-Mechanics Parts
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1973
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- 11
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Foundation anniversary
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- 08
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Incorporated Samsung Sanyo Parts Co., Ltd.