MLCC with a High Tolerance to Mechanical Stress
Thermal and mechanical stress on the chip can be reduced by the ductile properties of soft termination, which is resistant to stresses caused by board bending.
- Relax The Applied External Stress
- Products that can Reduce Thermal and Mechanical Stress on the Chip
- Excellent Bending Strength
- Excellent Bending Strength
MLCC with Increased Durability
It is a product that applies stress-management technology against external deformation to prevent MLCC defects from taking place when mechanical and thermal deformation of the PCB occurs. With greater durability than existing products, it can be used in applications that require safety.
- Bending Crack Prevention
- Use of Conductive Epoxy Material Technology that can Absorb Deformation Stress to Prevent Bending Cracks Caused by PCB Deformation
- 5mm Bending Guarantee
- Board Flex 5mm Guarantee
Application
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Automotive
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Mobile Phone
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Computer
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Solid State Drive
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Tablet
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Display
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SMPS
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DC-DC Converter