Wire Bonding High-Density Package Substrate for Memory
A product that connects semiconductor chips and package substrates with gold wire and whose chip size exceeds 80% of the package substrate area is generally referred to as WBCSP (Wire Bonding Chip Scale Package). It uses gold wire to connect the chip to the PCB and is mainly used for memory chips because it can be multi-packaged. In particular, UTCSP (Ultra Thin CSP) products can be manufactured with a thickness of 0.13㎜ or less. With a high degree of freedom in chip to PCB connection, multi-chip packaging is possible and high performance can be realized compared to packages of the same thickness.
WBCSP Lineup
Lineup by Specification
General WBCSP Road Map of HVM / Sample Product
| Routing Density | Bond Finger Pitch | 55P (25 / 12, Ni 3) (Mass Production) | 50P (20 / 10, Ni 2) (Sample Available) | |
|---|---|---|---|---|
| Line Width / Space | mSAP (Cu T 14) |
12 / 16um(Mass Production) | 10 / 15um(Sample Available) | |
| ETS (Cu T 13) |
7 / 8um (Mass Production) | 6 / 7um (Sample Available) | ||
| Via / Pad Size | mSAP | 50 / 90um(Mass Production) | 45 / 85um(Sample Available) | |
| ETS | 40 / 65um (Mass Production) | 37 / 60um (Sample Available) | ||
| SRO alignment | ± 12.5um (Mass Production) | ± 10um (Sample Available) | ||
| Min. SR Open size | 45um (Mass Production) | 40um (Sample Available) | ||
* um stands for ㎛
Lineup by Structure & Z-Height
| Layer count | Structure | Thickness | |
|---|---|---|---|
| 2Layer (Mass Production) | Cored (Mass Production) | 80um (Mass Production) | 75um |
| 3Layer (Mass Production) | Coreless (Mass Production) | 80um (Mass Production) | 75um |
| ETS (Mass Production) | 120um (Mass Production) | 100um | |
| 4Layer (Mass Production) | Cored (Mass Production) | 120um (Mass Production) | 110um |
| Coreless (Mass Production) | 110um (Mass Production) | 100um | |
| ETS (Mass Production) | 160um (Mass Production) | 140um | |
| 6Layer (Mass Production) | Cored (Mass Production) | 220um (Mass Production) | 180um |
| Coreless (Mass Production) | 200um (Mass Production) | 180um | |
* um stands for ㎛