FCBGA

High-Density Package Substrates for High-Integration Semiconductors

A high-density package substrate for connecting high-integration semiconductor chips to the main board. The semiconductor chip and the package substrate are connected with Flip Chip bumps, and fine matching between layers is required due to the miniaturization of the circuits on the substrate and the high multilayer. In particular, large body size and high multilayer (~110x110㎜, 26L) technology is required to support high performance computing.

FCBGA Lineup

FCB is available in Standard Core, Thin Core type products.

Mass Production Sample Available

Lineup FCB Core Thickness(um), Line Width / Space Bump Pitch (Mass Volume) - (4L, 6L, 8L, 10L, 12L, 14L, 16L, 18L, 20L, 22L) Standard Core, Thin Core
Core Thickness (um)		Line Width / Space Bump Pitch (Mass Volume)	Layer Counts
Core Thickness (um)		Line Width / Space Bump Pitch (Mass Volume)	4L	6L	8L	10L	12L	14L	16L	18L	20L	22L
Standard Core	1200	9 / 12um 90um	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Sample Available
	800		Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Sample Available
	600		Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Mass Production
	400		Mass Production	Mass Production	Mass Production	Mass Production	Mass Production	Sample Available
Thin Core	250	9 / 12um 100um	Mass Production	Mass Production	Mass Production	Mass Production	Sample Available
	200			Mass Production	Mass Production	Mass Production	Sample Available
	150			Mass Production	Mass Production	Sample Available

* um stands for ㎛

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Matters Concerning the Consignment of Personal Information Processing
Name of the Consignee Company	The Uber Creative
Representative Telephone Number	+82-2-517-5133
Consigned Work	Sending out newsletters, operation and maintenance of the website

Matters Concerning the Consignment of Personal Information Processing

Name of the Consignee Company

The Uber Creative

Representative Telephone Number

+82-2-517-5133

Consigned Work

Sending out newsletters, operation and maintenance of the website

SAMSUNG ELECTRO-MECHANICS

High-Density Package Substrates for High-Integration Semiconductors

FCBGA Lineup

FCB is available in Standard Core, Thin Core type products.

Application

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2. Terms of Retention and Usage of Personal Information

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4. Matters Concerning the Consignment of Personal Information Processing