MLCC for Thin Devices and Modules
To accommodate thin devices or modules, this can be mounted between the solder balls to reduce module thickness or secure the mounting area. It can supply current quickly in a stable manner to high-speed APs of mobile devices and is less susceptible to external environmental stress thanks to high-frequency noise removal.
- Thin in terms of Thickness
- Thin enough to Support Thin Devices and Modules
- Removing
High Frequency Noise - High-Frequency Noise Removal
Application
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Mobile Phone
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Wearable
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IC Package
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Module Products