Package Substrate

FCBGA

(Flip Chip Ball Grid Array)

고집적 반도체용
고밀도 패키지 기판

고집적 반도체 칩을 메인보드와 연결하기 위한 고밀도 패키지 기판입니다. 반도체 칩과 패키지 기판을 Flip Chip Bump로 연결하며, 기판 회로의 미세화 및 고다층에 따른 층간 미세 정합이 요구되고, 특히 High Performance Computing 대응을 위해 Large Body Size, 고다층 (~110x110㎜, 26L) 기술을 요구합니다.

FCBGA(Flip Chip Ball Grid Array) 부품의 구성요소 [1. Solder Ball: Main Board와 PC용 패키지 기판 연결용, 2. Solder Bump: Chip과 PC용 패키지 기판 연결, 3. Pattern: 전기신호를 전달하기 위하여 만든 전도성 구리 배선, 4. Chip]

FCBGA Lineup

FCB는 Standard Core, Thin Core 제품이 있습니다.
Mass Production Sample Available
Lineup FCB Core Thickness(um), Line Width / Space Bump Pitch (Mass Volume) - 범위 (4L, 6L, 8L, 10L, 12L, 14L, 16L, 18L, 20L, 22L)에 대한 Standard Core, Thin Core 내용을 제공합니다.
Core Thickness (um) Line Width / Space
Bump Pitch
(Mass Volume)
Layer Counts
4L 6L 8L 10L 12L 14L 16L 18L 20L 22L
Standard Core 1200 9 / 12um
90um
Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
800 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
600 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production    
400 Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available        
Thin Core 250 9 / 12um
100um
Mass Production Mass Production Mass Production Mass Production Sample Available          
200   Mass Production Mass Production Mass Production Sample Available          
150   Mass Production Mass Production Sample Available            

* um은 ㎛을 의미합니다.

TOP