고집적 반도체용
고밀도 패키지 기판
고집적 반도체 칩을 메인보드와 연결하기 위한 고밀도 패키지 기판입니다. 반도체 칩과 패키지 기판을 Flip Chip Bump로 연결하며, 기판 회로의 미세화 및 고다층에 따른 층간 미세 정합이 요구되고, 특히 High Performance Computing 대응을 위해 Large Body Size, 고다층 (~110x110㎜, 26L) 기술을 요구합니다.
FCBGA Lineup
FCB는 Standard Core, Thin Core 제품이 있습니다.
Core Thickness (um) | Line Width / Space Bump Pitch (Mass Volume) |
Layer Counts | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
4L | 6L | 8L | 10L | 12L | 14L | 16L | 18L | 20L | 22L | |||
Standard Core | 1200 | 9 / 12um 90um |
Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Sample Available |
800 | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Sample Available | ||
600 | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | ||||
400 | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Sample Available | ||||||
Thin Core | 250 | 9 / 12um 100um |
Mass Production | Mass Production | Mass Production | Mass Production | Sample Available | |||||
200 | Mass Production | Mass Production | Mass Production | Sample Available | ||||||||
150 | Mass Production | Mass Production | Sample Available |
* um은 ㎛을 의미합니다.