고집적 반도체용
고밀도 패키지 기판
고집적 반도체 칩을 메인보드와 연결하기 위한 고밀도 패키지 기판입니다. 반도체 칩과 패키지 기판을 Flip Chip Bump로 연결하며, 기판 회로의 미세화 및 고다층에 따른 층간 미세 정합이 요구되고, 특히 High Performance Computing 대응을 위해 Large Body Size, 고다층 (~110x110㎜, 26L) 기술을 요구합니다.
![FCBGA(Flip Chip Ball Grid Array) 부품의 구성요소 [1. Solder Ball: Main Board와 PC용 패키지 기판 연결용, 2. Solder Bump: Chip과 PC용 패키지 기판 연결, 3. Pattern: 전기신호를 전달하기 위하여 만든 전도성 구리 배선, 4. Chip]](/resources/images/kr/product/fcbga_sec_title_img.png)
FCBGA Lineup
FCB는 Standard Core, Thin Core 제품이 있습니다.
| Core Thickness (um) | Line Width / Space Bump Pitch (Mass Volume) |
Layer Counts | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 4L | 6L | 8L | 10L | 12L | 14L | 16L | 18L | 20L | 22L | |||
| Standard Core | 1200 | 9 / 12um 90um |
Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Sample Available |
| 800 | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Sample Available | ||
| 600 | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | ||||
| 400 | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Sample Available | ||||||
| Thin Core | 250 | 9 / 12um 100um |
Mass Production | Mass Production | Mass Production | Mass Production | Sample Available | |||||
| 200 | Mass Production | Mass Production | Mass Production | Sample Available | ||||||||
| 150 | Mass Production | Mass Production | Sample Available | |||||||||
* um은 ㎛을 의미합니다.
